ATP Electronics

ATP RAM DDR3

Key Features ATP-Built, Characterized and Tested from IC to Module 100% test during burn-in (TDBI) Available in monolithic 8 Gb one-chip select (1CS) Available in 8 Gb DDP two-chip select (2CS) Longevity Support Available DDR3 Configurations A typical monolithic DDR3 DRAM chip has a density of 4 Gigabits (Gb). To pack 8 Gb in a monolithic DRAM die, manufacturers employ a die-stacking method called dual-die package (DDP), which combines two bare memory dies within a single chip package. Each die has a separate set of control lines where each memory die is separately selectable, and the processor treats the chip as two components despite being in the same package. ATP DDR3 components are available in monolithic 8 Gb one-chip select (1CS) or as DDP two-chip select (2CS) for a variety of memory modules based on this technology. With ATP’s own-built DDR3 modules, the company reaffirms its commitment to continue supporting legacy memory requirements to maximize customers’ infrastructure investments.

Manufacturer

ATP Electronics

ATP Electronics

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ATP Electronics is a leading provider of high-quality memory and storage solutions for industrial applications. Founded in 1991, the company has focused on delivering robust SSDs, DRAM modules, and flash memory built to endure extreme conditions and continuous operation.

Their products serve critical sectors such as defense, transportation, automation, and medical technology. ATP's advanced engineering ensures data integrity, protection from data loss, and extended product lifecycles even under intense workloads.

Beyond standard offerings, ATP develops customized solutions with support for unique form factors, security features, and enhanced endurance.

Their commitment to quality is evident in their certifications and alignment with key industry standards and technology partners. With in-house manufacturing and global technical support, ATP is a trusted choice for mission-critical environments.

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