DDR3 ECC SODIMM
InnoDisk
DDR3 ECC SODIMM is an industrial memory module that provides lasting performance and is designed for the server and networking markets.
ATP Electronics
ATP RAM DDR3
Key Features
ATP-Built, Characterized and Tested from IC to Module
100% test during burn-in (TDBI)
Available in monolithic 8 Gb one-chip select (1CS)
Available in 8 Gb DDP two-chip select (2CS)
Longevity Support
Available DDR3 Configurations
A typical monolithic DDR3 DRAM chip has a density of 4 Gigabits (Gb). To pack 8 Gb in a monolithic DRAM die, manufacturers
employ a die-stacking method called dual-die package (DDP), which combines two bare memory dies within a single chip package.
Each die has a separate set of control lines where each memory die is separately selectable, and the processor treats the chip as
two components despite being in the same package.
ATP DDR3 components are available in monolithic 8 Gb one-chip select (1CS) or as DDP two-chip select (2CS) for a variety of memory modules based on this technology.
With ATP’s own-built DDR3 modules, the company reaffirms its commitment to continue supporting legacy memory requirements to maximize customers’ infrastructure investments.
ATP Electronics
We have been transforming the industrial and enterprise computing landscape with our high-performance and high-endurance NAND flash storage products and DRAM memory modules.
ATP Electronics (“ATP”) has dedicated 30 years of manufacturing excellence as the premier provider of memory and NAND flash storage products for rigorous embedded/industrial/automotive applications. As the “Global Leader in Specialized Storage and Memory Solutions,” ATP is known for its expertise in thermal and high-endurance solutions. ATP is committed to delivering add-on value, differentiation and best TCO for customers. A true manufacturer, ATP manages every stage of the manufacturing process to ensure quality and product longevity.
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